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Demand for High-Speed Transmission Flexible Printed Circuits (FPCs) and the Surge in Smartphone Speed and Communication Capacity
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The Manufacturing of Optical Semiconductors: Processes and Quality Control
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Optical Semiconductor Devices Explained
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Basics of Flexible Printed Circuit (FPC) Boards and Manufacturing Technology
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The Basics of Adhesion: Learning from Adhesive Tape Technology
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Five Challenges for Thermo-Curable Adhesives and Their Solutions
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Discover the Basics of “Adhesion”– Understand the Differences Between Adhesives and PSAs (Pressure Sensitive Adhesives)
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Characteristics “Low Dielectric” and”Low Dielectric Dissipation Factor”required for insulating materials thatconstitute circuit boards for high-speedtransmission and low dielectric bondingsheets
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Fundamentals of Sputtering
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New “flexible mold” technology for microstructure formation
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Low-Dielectric Thermosetting tape for the 6G Era: Support for Development of Internal Components of Smartphones
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Thermo-curable Adhesive Mechanisms (Crosslinking Reactions and Their Types)
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How to use industrial adhesives
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Anisotropic Conductive Film (ACF): a key part of biometric cards
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The future of drones and high-performance batteries
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The growth of electric motorcycles and battery safety
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The history of power tools and secondary protection element (SCP)
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Features and Benefits of Using Anisotropic Conductive Film (ACF) for Smart Cards
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Latest Trends in AR and VR Sensors
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Advantages of Credit Cards with Biometric Authentication
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Solutions for technical challenges of AR/VR devices
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VR, AR, MR, and XR technology – the growing metaverse market
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The future of cars – paving a new way for display technology
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- Electronic Components
The different types of TIMs (Thermal Interface Materials)
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Secondary protection technology for fast-charging smartphones
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The fundamentals of Anisotropic Conductive Film (ACF)
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Improving HUDs image quality with top-hat light distribution
