• Dexerials logo
    • Dexerials Corporation
  • TECH TIMES

    Technical information media for engineers

    • Bonding Products
    • Optical Products
    • Electronic Components
    • Photonics
    • Elemental Technologies
    • About this website
    • Contact Us
  • Japanese
  • English
    • Bonding Products
    2024/05/08

    Evaluation Methods for Functional Adhesive Tape

    • Elemental Technologies
    2024/05/08

    Precision Microstructures Created by Imprint Technology

    • Elemental Technologies
    2024/05/08

    Master Mold Processing: The Key to Imprint Technology

    • Bonding Products
    2024/04/25

    The Basics of Adhesives: Physical Properties

    • Bonding Products
    2024/04/25

    The Characteristics and Uses of Adhesive Tape

    • Bonding Products
    2024/04/24

    Demand for High-Speed Transmission Flexible Printed Circuits (FPCs) and the Surge in Smartphone Speed and Communication Capacity

    • Photonics
    2024/03/25

    The Manufacturing of Optical Semiconductors: Processes and Quality Control

    • Photonics
    2024/03/25

    Optical Semiconductor Devices Explained

    • Bonding Products
    2024/02/16

    Basics of Flexible Printed Circuit (FPC) Boards and Manufacturing Technology

    • Bonding Products
    2024/02/07

    The Basics of Adhesion: Learning from Adhesive Tape Technology

    • Bonding Products
    2024/02/06

    Five Challenges for Thermo-Curable Adhesives and Their Solutions

    • Bonding Products
    2024/02/01

    Discover the Basics of “Adhesion”– Understand the Differences Between Adhesives and PSAs (Pressure Sensitive Adhesives)

    • Bonding Products
    2024/02/01

    Characteristics “Low Dielectric” and”Low Dielectric Dissipation Factor”required for insulating materials thatconstitute circuit boards for high-speedtransmission and low dielectric bondingsheets

    • Elemental Technologies
    2024/02/01

    Fundamentals of Sputtering

    • Elemental Technologies
    2024/02/01

    New “flexible mold” technology for microstructure formation

    • Bonding Products
    2024/02/01

    Low-Dielectric Thermosetting tape for the 6G Era: Support for Development of Internal Components of Smartphones

    • Bonding Products
    2024/01/31

    Thermo-curable Adhesive Mechanisms (Crosslinking Reactions and Their Types)

    • Bonding Products
    2023/09/28

    How to use industrial adhesives

    • Bonding Products
    2023/03/15

    Anisotropic Conductive Film (ACF): a key part of biometric cards

    • Electronic Components
    2023/03/15

    The future of drones and high-performance batteries

    • Electronic Components
    2023/03/15

    The growth of electric motorcycles and battery safety

    • Electronic Components
    2023/03/15

    The history of power tools and secondary protection element (SCP)

    • Bonding Products
    2023/03/13

    Features and Benefits of Using Anisotropic Conductive Film (ACF) for Smart Cards

    • Elemental Technologies
    2023/03/13

    Latest Trends in AR and VR Sensors

    • Bonding Products
    2023/03/13

    Advantages of Credit Cards with Biometric Authentication

    • Elemental Technologies
    2023/03/03

    Solutions for technical challenges of AR/VR devices

    • Elemental Technologies
    2023/03/03

    VR, AR, MR, and XR technology – the growing metaverse market

Page 2 of 4«1234»
  • Return to TECH TIMES
  • About this website
  • Contact Us

KEYWORD

  • 5G(2)
  • ACF(20)
  • ACP(1)
  • Adhesion(1)
  • Adhesive(10)
  • Adhesive Tape(1)
  • Anisotropic conductive film(20)
  • Anisotropic Conductive Paste(1)
  • Anti-reflection(15)
  • AR/VR(3)
  • Automotive(9)
  • autonomous driving(2)
  • Avalanche photodiodes (APDs)(1)
  • Basic knowledge(36)
  • Bonding(1)
  • Bonding process(1)
  • Bonding Products(1)
  • Camera module(1)
  • Case study(3)
  • Data Centers(4)
  • Drone(1)
  • DWDM(1)
  • Elemental Technologies(1)
  • Epoxy adhesives(1)
  • EVs(1)
  • Exhibition Report(1)
  • fast-transmission(1)
  • FPC(4)
  • High capacity communication(1)
  • High speed transmission(1)
  • High-Speed Optical Communication(1)
  • Inorganic diffuser(3)
  • Inorganic optical component(4)
  • Inorganic polarizer(2)
  • Inorganic waveplate(2)
  • Inspection Process(1)
  • Interview(2)
  • LED(1)
  • LiDAR(2)
  • Lithium-ion battery(18)
  • medical equipment(1)
  • Medical face shield(1)
  • MicroLED(2)
  • Microstructure forming technology(1)
  • Moth-eye structure(3)
  • New product(1)
  • New technology(16)
  • OLED(1)
  • Optical bonding(1)
  • Optical device(2)
  • Optical elastic resin(5)
  • Optical semiconductors(2)
  • Optical Sensors(2)
  • optical transceiver(2)
  • photodiode(6)
  • photonics(11)
  • Product history(4)
  • Reflective sensor(2)
  • RFID(1)
  • Roll-to-roll(4)
  • SCP(2)
  • Secondary protection(17)
  • Smart card(4)
  • Smart phones(4)
  • Sputtering technology(2)
  • SWIR(2)
  • waveguide(3)

RANKING

    • Optical Products 2021.09.10

    Jettable SVR: A new optical elastic resin for var...

    • Electronic Components 2021.09.10

    What is “SCP”? – Protections of lithium (Li...

    • Electronic Components 2022.03.16

    Secondary protection element technology for highe...

    • Optical Products 2021.09.10

    New anti-reflection film technology, creating a l...

    • Optical Products 2021.09.10

    Anti-reflection film using roll-to-roll sputterin...

  • デクセリアルズグループ行動規範
  • デクセリアルズ・プライバシーポリシー
  • サイトご利用条件
© 2012 – 2025 Dexerials Corporation