低誘電ボンディングシート （2件）
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- Bonding Products
Characteristics “Low Dielectric” and”Low Dielectric Dissipation Factor”required for insulating materials thatconstitute circuit boards for high-speedtransmission and low dielectric bondingsheets
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- Bonding Products
Low-Dielectric Thermosetting tape for the 6G Era: Support for Development of Internal Components of Smartphones
