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NEW
- Bonding Products
MicroLED displays, the technology of tomorrow, and ArrayFIX, the particle-arrayed ACF that can support their adoption
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NEW
- Bonding Products
Achieving innovative microLED displays: the particle-arrayed Anisotropic Conductive Film (ACF) ArrayFIX
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NEW
- Bonding Products
The Evolution of Displays and the Supporting Role of ACF
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- Optical Products
Empowering Innovation: Dexerials’ strategic move into North America’s Autonomous Vehicles Market
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- Electronic Components
The Future of High-Voltage Electric Vehicles: The Importance of Battery Performance and Safety Measures
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- Optical Products
Five Dexerials Technologies to Enable Smaller, High-Performance LiDAR
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- Optical Products
The Basics of LiDAR, the Next Generation of Automotive Sensors
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- Electronic Components
Evolving Vacuum Cleaners and Future Safety: Protecting Lithium-ion Batteries with Surface-Mount Fuses
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- Electronic Components
Towards a Sustainable Society: The Recycling and Reuse of Lithium-ion Batteries and Dexerials’ Protective Devices
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- Electronic Components
Energy Storage Systems (ESSs) Utilizing Lithium-ion Batteries
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- Bonding Products
RFID Basics (Future Prospects and Anisotropic Conductive Paste)
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- Bonding Products
Anisotropic Conductive Films (ACFs) Applicable at Low Temperatures: Characteristics and Applications
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- Bonding Products
Technology for Epoxy Adhesives That Harden with UV Light and Heat
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- Bonding Products
Evaluation Methods for Functional Adhesive Tape
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- Elemental Technologies
Precision Microstructures Created by Imprint Technology
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- Elemental Technologies
Master Mold Processing: The Key to Imprint Technology
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- Bonding Products
The Basics of Adhesives: Physical Properties
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- Bonding Products
The Characteristics and Uses of Adhesive Tape
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- Bonding Products
Demand for High-Speed Transmission Flexible Printed Circuits (FPCs) and the Surge in Smartphone Speed and Communication Capacity
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- Photonics
The Manufacturing of Optical Semiconductors: Processes and Quality Control
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- Photonics
Optical Semiconductor Devices Explained
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- Bonding Products
Basics of Flexible Printed Circuit (FPC) Boards and Manufacturing Technology
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- Bonding Products
The Basics of Adhesion: Learning from Adhesive Tape Technology
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- Bonding Products
Five Challenges for Thermo-Curable Adhesives and Their Solutions
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- Bonding Products
Discover the Basics of “Adhesion”– Understand the Differences Between Adhesives and PSAs (Pressure Sensitive Adhesives)
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- Bonding Products
Characteristics “Low Dielectric” and”Low Dielectric Dissipation Factor”required for insulating materials thatconstitute circuit boards for high-speedtransmission and low dielectric bondingsheets
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- Elemental Technologies
Fundamentals of Sputtering
