FPC （4 Posts）
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- Bonding Products
Demand for High-Speed Transmission Flexible Printed Circuits (FPCs) and the Surge in Smartphone Speed and Communication Capacity
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- Bonding Products
Basics of Flexible Printed Circuit (FPC) Boards and Manufacturing Technology
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- Bonding Products
Characteristics “Low Dielectric” and”Low Dielectric Dissipation Factor”required for insulating materials thatconstitute circuit boards for high-speedtransmission and low dielectric bondingsheets
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- Bonding Products
Low-Dielectric Thermosetting tape for the 6G Era: Support for Development of Internal Components of Smartphones
